Trace Width Reduction Trend

mSAP: New PCB Technology to be used in 5G Smartphone

November 9, 2018

mSAP: New PCB Technology to be used in 5G Smartphone The light, small and multi-functional electronic products have led to the development of the printed circuit board on which the lines and vias depend on the high-density interconnection (HDI), but it still cannot meet the requirements of the future development. 5G’s massive processing capacity requires […]

Read More